Board Level Shielding (EMI/RFI/ESD shields)

Shimifrez EMI/RFI board level shielding parts assure the performance and maintainability of communications equipment, medical, radar applications and wave guides, computers, control systems, telecommunications, consumer and industrial electronics. EMI and ESD shields provide isolation of board-level components, and reduce the disturbance that affects an electrical circuit due to either electromagnetic induction or a radio frequency disturbance.

Bend channels

Hand-foldable, etched bend channels are one of the unique features that Shimifrez can incorporate into your RFI/EMI shielding enclosure. In the common metal thickness, our etched bend channels allow anyone to bend the sidewalls of a shield from a 2D blank to a 3D finished shield easily, quickly and precisely. You can compare bend channels to this feature as “metal origami”.

Bend channels can offer you several benefits.

First, although the etched bend channels are typically intended to create 90º right angle bends, they can also be used to create acute angle bends between 0º and 90º.
Second, since your shielding enclosure can be formed without the need for any traditional forming tooling, you can typically save hundreds of dollars in tooling and several days of delivery lead time for your prototype and production needs.
Third, because the etched bend channels exhibit a zero inside radii when formed, you can save space on your board by reducing the clearance necessary between the shield and the components within it.